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Default Sathyabama Institute of Science and Technology B.E. - Mechatronics Engineering SMRA1602 Micro Electro Mechanical Systems Syllabus

Sathyabama Institute of Science and Technology B.E. - Mechatronics Engineering SMRA1602 Micro Electro Mechanical Systems Syllabus

SATHYABAMA INSTITUTE OF SCIENCE AND TECHNOLOGY

SMRA1602 MICRO ELECTRO MECHANICAL SYSTEMS
L T P Credits Total Marks
3 0 0 3 100

UNIT 1 INTRODUCTION 9 Hrs.
Intrinsic Characteristics of MEMS – Energy Domains and Transducers- Sensors and Actuators – Introduction to Micro
fabrication – Silicon based MEMS processes – New Materials – Review of Electrical and Mechanical concepts in MEMS –
Semiconductor devices – Stress and strain analysis – Flexural beam bending- Torsional deflection.

UNIT 2 MICRO SENSORS AND ACTUATORS 9 Hrs.
Micro-sensing for MEMS: Piezo-resistive Pressure Sensor, Capacitive sensor, Piezoelectric sensing, Resonant sensing,
Surface Acoustic Wave sensors Vibratory gyroscope, Electromechanical transducers: Piezoelectric transducers,
Electrostrictive transducers, Magnetostrictive transducers, Electrostatic actuators, Electromagnetic transducers, Electrodynamic
transducers, Case study-Piezo-resistive pressure sensor, Comb drive actuators.

UNIT 3 MICROMACHINING 9 Hrs.
Silicon Anisotropic Etching – Anisotrophic Wet Etching – Dry Etching of Silicon – Plasma Etching – Deep Reaction Ion
Etching (DRIE) – Isotropic Wet Etching – Gas Phase Etchants – Case studies – Basic surface micro machining processes –
Structural and Sacrificial Materials – Acceleration of sacrificial Etch – Striction and Antistriction methods – LIGA Process –
Assembly of 3D MEMS – Foundry process.

UNIT 4 POLYMER AND OPTICAL MEMS 9 Hrs.
Polymers in MEMS– Polimide – SU-8 – Liquid Crystal Polymer (LCP) – PDMS – PMMA – Parylene – Fluorocarbon –
Application to Acceleration, Pressure, Flow and Tactile sensors- Optical MEMS – Lenses and Mirrors – Actuators for Active
Optical MEMS.

UNIT 5 MEMS PACKAGING AND APPLICATIONS 9 Hrs.
MEMS packaging: Role of MEMS packaging, Types of MEMS packaging, selection of packaging materials, flip-chip and
multichip Unit packaging, RF MEMS packaging issues. Micro-machined transmission line and components, micro-machined
RF Filters, Micromachined Phase shifters, and Micro-machined antenna, Gyros and Bio-MEMS. Recent.
Max. 45 Hrs.

COURSE OUTCOMES

On completion of the course, student will be able to
CO1 - Understand the basics of MEMS technology and microsystems.
CO2 - Acquire knowledge in the types and procedures involved in MEMS fabrication.
CO3 - Apply the acquired knowledge in understanding MEMS sensors and actuators.
CO4 - Analyse various MEMS design and familiarise with optical RF MEMS.
CO5 - Ability to understand the operation of micro devices, micro systems and their applications.
CO6 - Ability to design the micro devices, micro systems using the MEMS fabrication process.

TEXT / REFERENCE BOOKS

1. Vijay K. Varadan, K. J. Vinoy and K. A. Jose , “RF MEMS & Their Applications”, John Wiley & Sons, 2003.
2. Tai - Rai Hsu, “MEMS and Microsystems Design and Manufacturing”, Tata MC Graw Hill, New Delhi, Edition 2002.
3. Gabriel M Rebeiz, “RF MEMS - Theory Design and Technology”, John Wiley and Sons, 2003.
4. Nadim Maluf, “An introduction to Micro electro mechanical system design”, Artech House ,2000.
5. Chang Liu, ‘Foundations of MEMS’, Pearson Education Inc., 2012.

END SEMESTER EXAMINATION QUESTION PAPER PATTERN

Max. Marks: 100 Exam Duration: 3 Hrs.
PART A: 10 Questions of 2 marks each - No choice 20 Marks
PART B: 2 Questions from each unit with internal choice, each carrying 16 marks 80 Marks
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